ChEmpower, a semiconductor process innovation company, has introduced Chakra, a new family of functional polishing pads designed specifically for abrasive-free Chemical Mechanical Planarization (CMP). The launch begins with the Copper Series and forms a central component of the company’s patented planarization technology aimed at next-generation AI chips, High-Bandwidth Memory (HBM), and advanced packaging applications such as hybrid bonding.
For decades, semiconductor manufacturers have relied on conventional CMP pads that support slurry-based processes using abrasive particles to remove material. While effective, abrasive-assisted polishing can introduce variability, surface defects, and equipment wear. ChEmpower’s Chakra pad is engineered to function differently, actively participating in the planarization reaction rather than mechanically driving abrasives across the wafer surface.
When paired with the company’s proprietary chemical polishing fluid, Chakra enables material removal through controlled chemical reactions, eliminating the need for abrasive particles. According to ChEmpower, this approach improves surface integrity, minimizes defects, and enhances yield while preserving adjacent structures on increasingly dense and complex wafers.
“Chakra is more than a pad; it’s a functional material that actively drives the CMP process,” said Sudhanshu Misra, CEO and co-founder of ChEmpower. He described the pad as the enabling force within a three-element reactive system consisting of the functional pad, chemical polishing fluid, and the wafer material itself. Material removal occurs only where these three components interact, with the fluid continuously refreshed to ensure uniformity and low-defect surfaces.
The technology is particularly suited for copper interconnects, multi-layer metallization, HBM architectures, and planarization steps preceding hybrid bonding, applications where particle contamination or surface damage can directly impact bonding strength and device performance.
ChEmpower highlights several advantages of its abrasive-free approach, including improved precision and selectivity for controlled material removal, enhanced yield through elimination of particle-related defects, reduced tool wear and extended pad life, and sustainability benefits from removing abrasive waste and enabling water and metal reclamation.
Professor Babu, CTO and co-founder of ChEmpower, said advanced interconnects and hybrid bonding demand exceptional surface quality. “By eliminating abrasives and enabling controlled chemical reactions, Chakra delivers the consistency required for next-generation AI chips and advanced packaging,” he noted.
The company said its abrasive-free planarization technology is currently undergoing pilot evaluations at multiple semiconductor fabrication facilities, including AI-focused logic and HBM production lines. Early results indicate compatibility with existing CMP platforms and readiness for high-volume manufacturing.
Chakra™ pads and associated chemical polishing fluids are available to qualified customers, with plans to expand the technology to additional metals, refractory materials, silicon, and oxide applications.
