VeriSilicon has announced that Hefei Hexagon Semiconductor has adopted several of its processor IP solutions for the HX77 series image processing system-on-chip (SoC), a platform designed for next-generation augmented reality (AR) display devices. The HX77 SoC has successfully completed tape-out and achieved first-pass silicon success, marking a milestone in the development of low-power processors for wearable display systems.
According to the companies, the HX77 series integrates multiple components from VeriSilicon’s Nano IP portfolio, including the GCNanoUltraV 2.5D graphics processing unit (GPU) IP, DW100 DeWarp processing IP, and DC9200Nano display processing IP. These technologies work together to support high-performance graphics rendering, distortion correction, and display processing in compact wearable systems.
The HX77 platform is built on the RISC-V architecture and is designed as a highly integrated image processing SoC optimized for low power consumption. It incorporates video input and output interfaces, image processing engines, and system control features within a single chip architecture. By combining heterogeneous computing techniques with advanced power management, the processor is capable of delivering 2K resolution output at 60 frames per second while operating at milliwatt-level power consumption.
The system is also designed to support spatial computing functions, enabling a three-degrees-of-freedom (3DoF) hover capability for end devices. The SoC includes support for multiple display interfaces, including MIPI, LVDS, and DP/eDP, allowing manufacturers to configure a range of display topologies. This flexibility enables applications such as dual-screen independent displays commonly used in AR and virtual reality headsets.
A key design feature of the HX77 series is its ability to perform image buffering and processing without relying on external DDR memory. By enabling internal processing across GPU, display, and dewarp components, the system reduces both latency and overall power consumption. This approach is particularly important for wearable devices such as smart glasses, where power efficiency and compact form factors are critical.
“The first-pass silicon success of the HX77 series SoC validates its design goals in low power consumption, high integration, and display system flexibility,” said Suker Shu, Founder and CEO of Hexagon Semi. “VeriSilicon’s mature IP solutions played an important role in system architecture design and display quality, helping accelerate development for AI and AR glasses applications.”
Weijin Dai, Chief Strategy Officer and Executive Vice President at VeriSilicon, said the collaboration focused on optimizing pixel-level processing and data transmission to minimize energy consumption. “Through deep optimization at the pixel processing level and collaborative pixel data transmission across multiple IPs, we significantly reduced energy usage and eliminated the need for external DDR access,” Dai said.
The companies noted that their collaboration reflects growing industry demand for compact, power-efficient processors capable of supporting high-quality visual experiences in emerging smart glasses and wearable display devices.
