OKI Circuit Technology has developed new printed circuit board (PCB) technologies designed to support next-generation AI semiconductor testing equipment, marking a significant advance in high-density, high-performance interconnect solutions.
The company announced the successful development of design and production technologies for 180-layer PCBs with a thickness of 15 mm. These boards are intended for wafer testing systems used in high bandwidth memory (HBM) integrated with advanced AI semiconductors. The new configuration represents an increase of approximately 45% in layer count and nearly double the thickness compared to the company’s previous 124-layer, 7.6 mm design.
Mass production is targeted to begin in October 2026 at the Joetsu Plant in Niigata Prefecture, a facility with established expertise in high multilayer, large-format PCBs for semiconductor testing applications.
The development comes in response to the growing complexity of AI semiconductors. As processing capabilities increase, so does the volume of data signals handled during wafer testing. At the same time, ongoing process miniaturization is driving higher chip densities on wafers. These factors are placing new demands on PCB design, including tighter signal routing, higher layer counts, and improved electrical performance.
However, increasing PCB thickness introduces technical challenges. These include difficulty in controlling via impedance, reduced power delivery efficiency, and limitations in drilling precise, deep microvias. Historically, these constraints limited practical PCB designs to 124 layers and 7.6 mm thickness.
To overcome these barriers, OKI Circuit Technology developed two key innovations. The first is a sintering paste-based via bonding technology, which enables multiple multilayer PCBs to be stacked and electrically connected through their vias. The second is a manufacturing approach for producing ultra-thick PCBs of up to 15 mm.
By combining these technologies, the company has created a structure that stacks three 60-layer PCBs into a single 180-layer configuration. This modular approach allows each individual board to maintain controlled signal integrity and power performance using established manufacturing techniques, while collectively achieving ultra-high density.
The result is a PCB platform capable of meeting future requirements for high-speed, high-frequency, and high-density data transfer. The technology is expected to support not only AI semiconductor testing but also adjacent sectors, including AI servers, aerospace and defense systems, and next-generation communication infrastructure.
The company indicated it will continue advancing PCB technologies to align with evolving semiconductor performance demands, with a focus on enabling scalable, high-precision manufacturing solutions for emerging applications.
