Amkor Technology (Nasdaq: AMKR) has expanded its advanced semiconductor packaging footprint in the United States through the acquisition of additional land in Arizona.
The company announced that it has secured an additional 67-acre parcel adjacent to its existing campus in Peoria’s Innovation Core. The move expands Amkor’s long-term development capacity at its Arizona manufacturing site.
Amkor’s campus is currently being developed across a 104-acre site focused on advanced semiconductor packaging and test operations. The company said the newly acquired land will provide flexibility for future expansion and help address evolving customer demand.
The Arizona facility is expected to become the first high-volume advanced packaging outsourced semiconductor assembly and test (OSAT) facility in the United States.
The project is aimed at supporting growing semiconductor demand across sectors including artificial intelligence, high-performance computing, automotive electronics, and communications infrastructure.
Advanced packaging technologies have become increasingly important as semiconductor companies seek higher performance, greater energy efficiency, and improved chip integration for next-generation computing applications.
Kevin Engel, President and Chief Executive Officer of Amkor Technology, said the investment strengthens the company’s ability to support customers with advanced packaging and testing solutions while contributing to supply chain resilience.
The expansion also aligns with broader efforts to strengthen semiconductor manufacturing and advanced packaging capabilities within the United States amid increasing global demand for chips and advanced computing technologies.
