The European Union has officially approved the Framework Partnership Agreement for CHAMP-ION (Championing a European Advanced Manufacturing Pilot Line of Ion-Traps), a…
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ClassOne Technology has entered into a joint development agreement with IBM Research to advance wet processing solutions for semiconductor manufacturing, focusing on…
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GlobalFoundries (Nasdaq: GFS) has signed a Memorandum of Understanding (MOU) with Singapore’s Agency for Science, Technology and Research (A*STAR) to accelerate research…
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NewsPower ElectronicsProduct LaunchSemiconductorsTechnology
Toshiba Shrinks Power Loss with New 650V SiC MOSFETs
Toshiba Electronic Devices & Storage Corporation has released four new 650V silicon carbide (SiC) MOSFETs incorporating its latest third-generation chip technology. Housed…
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Vertiv (NYSE: VRT), a global provider of critical digital infrastructure and continuity solutions, has announced plans to introduce a comprehensive 800 VDC…