PC chip major Intel CEO Lip-Bu Tan is likely to visit Odisha later this year for the ground-breaking ceremony of 3D Glass…
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News
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Data CenterNewsProduct Launch
nVent Adds U.S. Production Site to Meet Liquid Cooling Demand
by EC Editorby EC EditornVent Electric plc (NYSE: NVT), a global provider of electrical connection and protection solutions, announced it has leased a new 117,000-square-foot manufacturing…
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BatteriesMarketNewsProduct Launch
France’s CEA, ProLogium Advance Sustainable Battery Tech
by EC Editorby EC EditorThe French Alternative Energies and Atomic Energy Commission (CEA) and Taiwan-based ProLogium Technology have announced a technical partnership to develop solid-state battery…
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NewsProduct LaunchSemiconductorsTechnology
India’s Semiconductor Leap: Vikram-32 Heralds a New Era in Technological Sovereignty
by EC Editorby EC EditorIndia officially joined the elite group of nations capable of designing and manufacturing advanced microprocessors with the unveiling of Vikram-32, the country’s…
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BusinessNewsRoboticsTechnology
JP Hathout to Lead Teradyne Robotics, Succeeding Kumar
by EC Editorby EC EditorTeradyne Inc. (NASDAQ: TER) has appointed Jean-Pierre “JP” Hathout as President of the Teradyne Robotics Group, the company announced Tuesday. Hathout succeeds…