As semiconductor manufacturers push toward larger, denser, and more complex chip architectures for AI and high-performance computing, packaging materials are emerging as…
Category:
Product Launch
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Data CenterNewsProduct LaunchSemiconductorsTechnology
Wolfspeed Targets AI Energy Demand With New SiC Modules
by EC Editorby EC EditorWolfspeed is expanding its silicon carbide power portfolio with two new 3.3 kV SiC power module families aimed at addressing rising energy…
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NewsProduct LaunchSensors
Ouster Develops Native Color Lidar With Fujifilm Technology
by EC Editorby EC EditorOuster, Inc. (Nasdaq: OUST is moving deeper into multimodal sensing with a new native color lidar platform developed alongside FUJIFILM Corporation, as…
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AI / AR / VRNewsProduct LaunchSemiconductorsTechnology
MaxLinear Expands USB UART Portfolio for AI Data Centers
by EC Editorby EC EditorMaxLinear (NASDAQ: MXL) has expanded its USB UART portfolio with the launch of the Coronado and Laguna product families, targeting growing control-plane…
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NewsProduct LaunchSemiconductorsTechnology
MaxLinear Achieves DOCSIS 3.1 VFI With Puma 8
by EC Editorby EC EditorMaxLinear announced that it has become the first silicon vendor to achieve DOCSIS 3.1 Verified for Interoperability (VFI) certification using its Puma…