Teradyne and MultiLane have announced plans to form a joint venture aimed at addressing the rapidly growing demand for high-speed test and measurement solutions in AI-driven data center infrastructure. The new entity, named MultiLane Test Products (MLTP), will focus on accelerating the development of test solutions for critical high-speed data connections used across modern compute architectures.
The transaction is expected to close in the first half of 2026, subject to customary regulatory approvals and closing conditions. Once completed, the joint venture will operate as a dedicated platform serving semiconductor, system, and data center equipment manufacturers facing rising performance and reliability requirements.
Under the agreement, MultiLane will contribute all assets related to its test and measurement business to MLTP. The company will continue to operate its existing interconnect and data center test solution businesses outside the joint venture. Teradyne will hold a majority ownership stake in MLTP, while MultiLane will retain a minority interest.
The partnership brings together Teradyne’s global presence in electronic test and automated systems with MultiLane’s expertise in high-speed instrumentation and connectivity testing. Both companies say the combination is designed to deliver more comprehensive, agile, and scalable test solutions across the full compute infrastructure, from semiconductor devices to deployed data center systems.
Industry demand for such capabilities is being driven by the rapid evolution of compute architectures, particularly those supporting artificial intelligence workloads. AI systems rely on increasingly dense and high-bandwidth interconnects to move data efficiently between processors, accelerators, memory, and networking equipment. As speeds rise and tolerances narrow, testing high-speed I/O becomes more complex and critical to system performance and reliability.
Teradyne President and Chief Executive Officer Greg Smith said the joint venture will allow the company to extend its support for customers across a broader portion of the value chain. He noted that MultiLane’s innovation in high-speed testing complements Teradyne’s scale and customer reach, and is expected to expand the served market for Teradyne’s semiconductor test and product test businesses.
MultiLane Founder and Chief Executive Officer Fadi Daou said the collaboration reflects the growing importance of high-speed connectivity in modern computing. He added that combining MultiLane’s technical leadership with Teradyne’s global commercial platform would help accelerate innovation and deliver end-to-end test solutions spanning silicon, systems, and data center infrastructure.
Both companies said MLTP is expected to strengthen their ability to support customers as AI and data center deployments continue to scale in speed, complexity, and volume.
