Aitech and Teledyne e2v Semiconductors are advancing their collaboration in space-grade computing with the integration of Teledyne’s radiation-tolerant semiconductors into Aitech’s SP1 single-board computer (SBC).
The SP1 is a 3U SpaceVPX radiation-tolerant SBC designed for deployment across low Earth orbit (LEO), geostationary orbit (GEO), lunar, and deep space missions. The platform targets spacecraft and payload systems requiring high-performance edge computing, onboard data analysis, and mission adaptability.
At the core of the SP1 is Teledyne e2v’s QLS1046-Space system-on-chip (SoC), part of the Qormino® family. The SoC integrates four 64-bit Arm Cortex-A72 cores and DDR4 memory with error correction code (ECC). The multi-core architecture and high-bandwidth memory are designed to support artificial intelligence-based algorithms for onboard processing and autonomous decision-making.
According to Teledyne e2v, the QLS1046-Space SoC has been radiation-tested to 100 krad (Si) and is immune to latch-up at 67 MeV-cm²/mg, supporting reliable operation in harsh space environments. The device is engineered to maintain performance while ensuring data integrity under extreme radiation conditions.
D. Davis, General Manager of Aitech (ADSI), said radiation-tolerant, high-performance SBCs are essential for modern missions that must process complex workloads while operating in challenging environments. He noted that combining ruggedized hardware with radiation-tolerant semiconductor technology enhances mission reliability and adaptability.
David Hien, General Manager of Teledyne e2v Semiconductors, said the QLS1046-Space SoC enables onboard AI and machine learning capabilities, allowing spacecraft to process data locally and make real-time decisions without relying solely on ground control.
Beyond its processing capabilities, the SP1 includes a high-capacity FPGA to provide flexibility for customer-specific IP integration and interface expansion. The platform is positioned for applications including Earth observation, communications, command and data handling (C&DH), robotic vision processing, power distribution, and signal analysis.
