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Home » Startup » AttoTude Raises US$52 Million to Advance AI Interconnect Technology

AttoTude Raises US$52 Million to Advance AI Interconnect Technology

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AttoTude Inc., a developer of AI infrastructure interconnect technology, has raised US$52 million in a Series C funding round. The investment will support product development and commercialization of the company’s connectivity platform for hyperscale AI infrastructure.

The funding round was led by The Westly Group. New investors included Keysight Technologies, Inc. (NYSE: KEYS), Allegis Capital, and DNX. Existing investors Sutter Hill Ventures, Mayfield, Canaan, and Wing Venture Capital also participated.

The latest funding brings AttoTude’s total capital raised to US$143 million.

The company is developing a new interconnect category for large AI clusters. Its technology is based on an “ASIC over Dielectric” architecture that enables electrical signals to travel directly over dielectric waveguides. The approach is designed to overcome limitations associated with traditional copper-based interconnects.

AttoTude said its platform delivers reliable, low-power, and high-density connectivity for AI infrastructure. The technology supports per-lane data rates of 200G, 400G, and 800G. It is aimed at meeting growing networking demands created by larger AI models and expanding compute clusters.

The company said its solution can provide scalable mid-range connectivity while avoiding some of the cost, complexity, power, and reliability challenges associated with optical technologies. It is also designed to support future high-speed interfaces as AI infrastructure continues to evolve.

The new funding will be used to move the technology from development to commercialization. Planned activities include building prototypes, expanding engineering efforts, and establishing a scalable supply chain. AttoTude also plans to prepare the platform for deployment with hyperscale and AI infrastructure companies.

“This financing marks a pivotal step as we transition AttoTude’s ASIC over Dielectric interconnect technology from transformative innovation to product,” said Dave Welch, CEO and co-founder of AttoTude. He added that the company expects to showcase its first product demonstrations later this year.

Investors pointed to the growing need for new interconnect technologies as AI infrastructure expands rapidly.

Steve Westly, Managing Partner at The Westly Group, said AttoTude is addressing critical bottlenecks in the AI ecosystem. He added that the company has achieved strong performance while helping reduce energy consumption in modern AI clusters.

The funding round also strengthens AttoTude’s collaboration with Keysight Technologies. Joachim Peerlings, Vice President and General Manager of the Networks and Data Center Group at Keysight, said new interconnect architectures will be essential for improving performance and efficiency as AI infrastructure scales.

The announcement comes as investment in AI infrastructure continues to rise globally. Growing adoption of generative AI is increasing demand for faster data movement, higher bandwidth, and more energy-efficient networking technologies.

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