Kyocera Corporation has announced the commercialization of a multilayer ceramic core substrate designed to support next-generation semiconductor packages used in AI data…
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2.5D packaging
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NewsProduct LaunchSemiconductorsTechnology
Onto Innovation Qualifies Dragonfly G5 for 2.5D AI Packaging
by EC Editorby EC EditorOnto Innovation Inc. (NYSE: ONTO) has announced the successful qualification of its Dragonfly G5 system for both new and existing applications in…