Taiwan Semiconductor Manufacturing Co. (NYSE: TSM) is sharply expanding advanced-packaging capacity as the rapid growth of AI accelerators pushes chipmakers to combine…
Tag:
2.5D packaging
-
-
NewsProduct LaunchSemiconductorsTechnology
Kyocera Unveils Ceramic Substrate for AI Chips
by EC Editorby EC EditorKyocera Corporation has announced the commercialization of a multilayer ceramic core substrate designed to support next-generation semiconductor packages used in AI data…
-
NewsProduct LaunchSemiconductorsTechnology
Onto Innovation Qualifies Dragonfly G5 for 2.5D AI Packaging
by EC Editorby EC EditorOnto Innovation Inc. (NYSE: ONTO) has announced the successful qualification of its Dragonfly G5 system for both new and existing applications in…