Amkor Technology (Nasdaq: AMKR) is expanding its planned advanced semiconductor packaging and test campus in Arizona, adding 60,000 square meters of cleanroom…
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Chip Packaging
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BusinessNewsSemiconductorsTechnology
Intel Names Seok-Hee Lee to Foundry Leadership
by EC Editorby EC EditorIntel Corporation (NASDAQ: INTC) has appointed Seok-Hee Lee as executive vice president of Intel Foundry, a move aimed at strengthening the company’s…
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BusinessNewsSemiconductorsTechnology
U.S. to Award SK hynix up to $450m for Chip-Packaging Facility
by EC Editorby EC EditorThe U.S. Commerce Department said on Tuesday it plans to award SK hynix up to $450 million in grants to help fund…
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BusinessNewsSemiconductorsTechnology
TSMC Considering Advanced Chip Packaging Capacity in Japan, Sources Say
by EC Editorby EC EditorTaiwan’s TSMC (2330.TW), opens new tab is looking at building advanced packaging capacity in Japan, according to two sources familiar with the matter, a…