Taiwan Semiconductor Manufacturing Co. (NYSE: TSM) is sharply expanding advanced-packaging capacity as the rapid growth of AI accelerators pushes chipmakers to combine…
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HBM
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BusinessNewsSemiconductorsTechnology
SK hynix Commits KRW 54 Trillion to New AI Memory Fabs
by EC Editorby EC EditorSK hynix Inc. (KRX: 000660) is committing about KRW 54 trillion to two new semiconductor fabs in South Korea, stepping up investment…
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NewsProduct LaunchSemiconductorsTechnology
NEO Semiconductor Develops 3D X-AI Chip Technology, to Replace DRAM Chips Inside HBM
by EC Editorby EC Editor3D NAND flash memory and 3D DRAM developer, NEO Semiconductor completes the development of its 3D X-AI chip technology. This technology will…