Baya Systems has announced a strategic partnership with Aion Silicon to accelerate the development of next-generation system-on-chip (SoC) and chiplet-based designs. The collaboration brings together Baya’s software-driven semiconductor fabric IP with Aion’s ASIC and SoC architecture and design expertise to offer an integrated, end-to-end solution for complex silicon programs.
Baya Systems is known for its chiplet-ready fabric technology targeting scalable AI, high-performance computing (HPC), and automotive applications. Aion Silicon, formerly Sondrel, provides ASIC and SoC architecture and implementation services. The joint offering is designed to enable faster definition, design, and deployment of advanced SoC and multi-die systems for shared customers.
At the core of the solution is Baya’s WeaverPro FabricStudio system architecture exploration platform and WeaveIP fabric technology. These tools provide a high-performance, unified data-movement backbone connecting compute, memory, and accelerators. The architecture supports both coherent and non-coherent traffic on a single fabric, addressing the growing complexity of heterogeneous workloads.
Aion contributes system architecture, integration, and silicon implementation capabilities, translating system requirements into production-ready silicon across single-die and chiplet-based platforms. The companies state that early adopters are already reporting improved performance predictability, reduced integration risk, and a faster path to production.
According to the partners, key customer benefits include shorter time-to-silicon, scalable bandwidth, deterministic performance under demanding workloads, and flexibility to adapt to evolving standards. The joint solution is positioned to support CPUs, GPUs, NPUs, and other accelerators within increasingly complex AI and HPC systems.
Dr. Sailesh Kumar, CEO and founder of Baya Systems, said flexibility and scalability have become essential in modern semiconductor architectures. He noted that combining intelligent data-movement fabric technology with proven silicon execution enables customers to unlock the full potential of advanced SoC and chiplet designs.
Oliver Jones, CEO of Aion Silicon, said the partnership allows customers to translate ambitious system concepts into working silicon more efficiently. He added that the collaboration strengthens the ability to manage complexity while maintaining performance, power, and area efficiency in next-generation semiconductor platforms.
