Kyocera Corporation develops a new pluggable optoelectronic module designed to support the next-generation PCI Express 6.0 standard, aiming to enable faster and more energy-efficient communication in AI data centers. The module, based on the OSFP-XD form factor, is the latest addition to the company’s OPTINITY optoelectronic module series and is designed to enhance optical communication and power efficiency in high-performance computing environments.
The newly developed module converts electrical signals generated by computing components such as CPUs, GPUs, and AI accelerators into optical signals, enabling high-capacity data transmission over longer distances with improved signal integrity. By supporting PCIe 6.0 connectivity with x16 lanes and speeds of up to 64 gigatransfers per second (GT/s) per lane, the module aims to meet the increasing data throughput requirements of next-generation AI workloads.
The development comes amid rapidly growing demand for high-performance computing infrastructure as generative AI and data-intensive applications continue to expand. In modern data centers, large clusters of GPUs and AI accelerators must exchange massive volumes of data with minimal latency. Traditional electrical PCIe connections can experience signal degradation and higher power consumption as transmission distances increase.
To maintain signal stability over longer distances, electrical connections typically require retimers—components that help regenerate signals but add latency and increase energy consumption. Kyocera’s optical interconnect approach eliminates the need for such retimers in many configurations, enabling lower power consumption between PCIe devices and improving overall efficiency within data center environments.
Another key feature of the new module is its pluggable design, which provides system architects with greater flexibility when integrating optical connectivity into servers and computing platforms. Unlike onboard optical modules that are directly mounted onto circuit boards, pluggable modules allow easier installation, replacement, and system upgrades. This flexibility supports evolving infrastructure requirements in hyperscale data centers and high-performance computing facilities.
Optical fiber transmission also enables significantly longer connection distances compared with conventional electrical links. While electrical PCIe wiring is typically limited to distances of less than 10 meters, optical connections can extend communication between devices to several hundred meters. This extended reach allows data center operators to position computing equipment more flexibly within and between racks, potentially improving airflow, cooling efficiency, and maintainability.
The new module was developed in collaboration with AuthenX Inc., a Taiwanese startup specializing in high-speed optical transceiver design using silicon photonics technologies. Kyocera has been working with the company on next-generation optical interconnect technologies and invested in AuthenX through the Kyocera Venture Innovation Fund I in December 2025 to strengthen collaboration in this area.
According to Kyocera, the joint development combines AuthenX’s expertise in optical module design with Kyocera’s experience in PCIe protocol processing, signal quality management, and link training technologies. The companies aim to accelerate the commercialization of optical interconnect solutions for next-generation AI and high-performance computing systems.
The new module will be exhibited at OFC 2026, a major international exhibition for optical communications technology scheduled to take place in Los Angeles from March 17 to 19, 2026. The technology will be displayed at the AuthenX booth, where visitors will be able to learn more about its potential applications in advanced data center architectures.
Looking ahead, Kyocera plans to expand its optoelectronic module lineup beyond onboard and OSFP-XD formats. The company said it intends to develop additional form factors, including Optical CDFP modules, to support a wider range of computing applications and system configurations as demand for high-speed optical interconnects continues to grow.
