Power Integrations has introduced a new generation of flyback converter technology that significantly extends the power range of this widely used topology, enabling up to 440 W output—traditionally achievable only with more complex resonant and LLC designs. The breakthrough comes with the launch of the TOPSwitchGaN IC family, which combines the company’s PowiGaN platform with its established TOPSwitch architecture.
The development marks a notable shift in power supply design, offering engineers a simpler alternative to resonant topologies that have historically been required for higher power applications. By extending the capabilities of flyback converters, the new ICs aim to reduce system complexity, shorten design cycles, and lower overall costs, while maintaining high levels of efficiency and performance.
According to Silvestro Fimiani, Director of Product Marketing at Power Integrations, the introduction of TOPSwitchGaN represents more than an incremental improvement. He emphasized that for decades, engineers have relied on resonant designs such as LLC converters as power demands increased. With the new technology, flyback converters can now operate in a previously unattainable power range, delivering comparable efficiency with a significantly simplified architecture.
The TOPSwitchGaN ICs achieve up to 92 percent efficiency across a wide load range, from 10 percent to full load, and meet stringent European Energy-related Products (ErP) regulations with standby and off-mode power consumption below 50 mW. Notably, these performance levels are achieved without the need for synchronous rectification, further simplifying circuit design.
At the core of this advancement is PowiGaN technology, which utilizes gallium nitride (GaN) switches to deliver lower RDS(ON) compared to conventional silicon-based devices. This results in reduced conduction losses and improved overall efficiency. The ICs incorporate 800 V-rated PowiGaN switches, offering strong surge resilience and low switching losses, enabling operation at frequencies of up to 150 kHz. Higher switching frequencies also allow for smaller transformer sizes, contributing to more compact system designs.
The devices are designed to support a broad range of applications, including high-end consumer appliances, e-bike chargers, industrial power supplies, and power tools. In standby mode, the ICs demonstrate low no-load consumption, while still providing sufficient output power to support housekeeping functions.
From a packaging perspective, Power Integrations offers the new ICs in multiple formats to address varying design requirements. The low-profile eSOP-12 surface-mount package enables up to 135 W output without requiring a heat sink, making it suitable for space-constrained applications. Meanwhile, the eSIP-7 package, with its vertical orientation, minimizes printed circuit board footprint and provides thermal performance comparable to traditional TO-220 packages. When paired with a simple clip-mounted heat sink, the devices can achieve their full extended power range.
Importantly, the TOPSwitchGaN ICs are pin-to-pin compatible with TinySwitch-5 devices, allowing designers to use a consistent design approach across a wide power spectrum ranging from 10 W to 440 W.
The new IC family is available starting at $1.00 in high-volume quantities, with multiple reference design kits provided to support rapid development across applications such as appliance power supplies, industrial systems, and e-bike chargers.
