proteanTecs has announced a collaboration with Gubo Technologies Co., Ltd. to deliver an integrated analytics solution for advanced semiconductor systems. The partnership brings together deep data monitoring and post-silicon workflow automation to provide broader visibility across the chip lifecycle.
proteanTecs is known for its health and performance monitoring solutions for advanced electronics. Gubo Technologies is recognized as China’s first provider of post-silicon workflow automation solutions. Together, the companies aim to offer actionable insights into yield, quality, performance, and reliability from early design stages through in-field operation.
The collaboration comes as the semiconductor industry faces mounting pressure from rapid AI adoption. Companies are racing to develop chips that can support large-scale artificial intelligence workloads. This shift is increasing demands on energy efficiency, compute density, and system reliability. High-performance computing, data centers, automotive electronics, cloud infrastructure, and telecom networks are all affected.
Industry players are seeking deeper visibility into device behavior during manufacturing and throughout operational life. The joint solution is designed to address that need.
The combined offering integrates proteanTecs’ on-chip Agents and advanced analytics with Gubo Technologies’ OneData platform and cloud analytics capabilities. The solution is expected to support unified analytics across design validation, silicon bring-up, high-volume production, and field deployment. The goal is to enable data-driven decision-making at every stage.
Hao Zhou, CTO of Gubo Technologies, said the collaboration will enhance predictability in chip and system health, performance, and reliability. He added that integrating telemetry data into the OneData platform allows customers to maximize the value of semiconductor data across the supply chain.
Alex Burlak, Executive Vice President of Engineering and Customer Success at proteanTecs, noted that AI innovation is placing new demands on performance-per-watt, cost efficiency, and resilience. He said the combined platform will extend insight into device behavior while strengthening manufacturing workflows.
The companies expect the collaboration to support customers navigating increasing complexity across the semiconductor ecosystem.
