Mountain View, California-based developer of engineered-diamond materials Diamond Quanta has announced Adamantine Thermal, a new thermal platform designed for integration into advanced semiconductor packaging workflows and heterogeneous systems. The announcement follows the company’s debut at CES 2026 Eureka Park and reflects growing industry interest in diamond-enabled solutions for next-generation electronics.
At CES 2026, Diamond Quanta showcased its 300 mm diamond-on-silicon wafer technology, engineered for compatibility with wafer-to-wafer (W2W) and chip-to-wafer (C2W) bonding processes, alongside its first commercial product, Adamantine Optics. According to the company, discussions with system OEMs, semiconductor manufacturers, and ecosystem partners at the event highlighted increasing demand for practical pathways to introduce diamond into advanced packaging flows.
Adamantine Thermal builds on the same engineered-diamond manufacturing approach demonstrated at CES. While diamond is widely recognized for its superior intrinsic thermal conductivity, its adoption in semiconductor packaging has historically been constrained by challenges related to surface roughness, bonding compatibility, and scalability. Diamond Quanta said its platform addresses these barriers through CMOS-compatible, low-temperature diamond growth on industry-standard substrates, laser-based densification to achieve smooth, bond-ready surfaces, and support for W2W and C2W bonding workflows.
“Thermal is the most immediate and universal entry point for diamond in electronics,” said Adam Khan, Founder and CEO of Diamond Quanta. “Once diamond can be bonded reliably and at scale, it stops being a research material and becomes a practical platform.”
A primary application area for Adamantine Thermal is engineered-diamond glass interposers. Glass interposers are gaining momentum in advanced packaging due to their signal integrity and dimensional stability, and the addition of diamond is intended to enable more uniform thermal management while improving flatness and mechanical robustness.
Diamond Quanta noted that Adamantine Thermal has been designed to remain compatible with standard fab infrastructure and panel-scale workflows, positioning it as a bridge between conventional thermal materials and future diamond-enabled electronic architectures. The company confirmed that the platform has entered partner evaluation programs, with engineered-diamond interposer concepts progressing in alignment with industry adoption cycles.
