Syenta has secured $26 million in a Series A funding round to accelerate the commercialization of its advanced semiconductor packaging technology aimed…
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advanced semiconductor packaging
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NewsSemiconductorsTechnology
Diamond Quanta Pushes Diamond Into Chip Packaging
by EC Editorby EC EditorMountain View, California-based developer of engineered-diamond materials Diamond Quanta has announced Adamantine Thermal, a new thermal platform designed for integration into advanced…