LG Chem (KRX: 051910) has entered the semiconductor stripper market after beginning mass production and supply of semiconductor stripping materials to Amkor Technology (NASDAQ: AMKR), marking the company’s first commercial expansion into the segment.
The move strengthens LG Chem’s strategy to expand its semiconductor materials business as demand for advanced chip packaging materials continues to rise with the growth of artificial intelligence (AI) and high-bandwidth memory (HBM) technologies.
Semiconductor strippers are process chemicals used to remove photoresist (PR) and residual materials from semiconductor wafers after circuit patterning. As semiconductor devices become more densely integrated, efficient residue removal has become increasingly important for improving manufacturing yields and ensuring device reliability.
LG Chem said it entered the market by leveraging technology and customer support capabilities developed through its display stripper business. The company completed Amkor’s qualification process, allowing its first semiconductor stripper product to move into mass production.
Amkor Technology is one of the world’s largest outsourced semiconductor assembly and test (OSAT) providers, offering semiconductor packaging and testing services to leading chip manufacturers globally.
According to LG Chem, the stripper supplied to Amkor has been tailored for the company’s new production line. The material reduces the time required to remove photoresist and process residue by around 50% compared with conventional products, improving manufacturing efficiency.
The company said the development reflects growing demand for high-performance semiconductor process materials as AI-driven computing, advanced chip packaging and HBM adoption continue to expand across the semiconductor industry.
Kim Dong Choon, Chief Executive Officer of LG Chem, said the collaboration with Amkor strengthens the company’s ability to deliver customised materials designed for customers’ manufacturing processes.
The announcement follows LG Chem’s strategy unveiled earlier this year to more than double the size of its electronics materials business.
As part of that plan, the company is expanding its semiconductor materials portfolio beyond strippers to include copper-clad laminates (CCL), die attach films (DAF) and photo-imageable dielectric (PID) materials used in advanced semiconductor packaging.
The expansion comes as semiconductor manufacturers invest in next-generation packaging technologies to support AI processors and high-performance computing applications, increasing demand for specialised process chemicals and electronic materials.
