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Kioxia Expands Embedded Storage with QLC UFS 4.1 Memory

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Kioxia Corporation has started sampling new Universal Flash Storage (UFS) Version 4.1 embedded flash memory devices based on quadruple-level cell (QLC) technology. The move targets growing demand for higher-capacity storage in mobile and connected devices.

The new devices use Kioxia’s eighth-generation BiCS FLASH 3D memory technology. By storing four bits per cell, QLC delivers higher bit density than traditional triple-level cell (TLC) memory. This allows device makers to increase storage capacity without enlarging the package size. Improvements in controller design and error correction help maintain competitive performance despite the higher density.

Kioxia reports strong performance gains over its previous QLC UFS generation. Sequential write speeds improve by 25 percent. Random read performance increases by 90 percent, while random write speeds rise by 95 percent. The company also notes up to a 3.5× improvement in write amplification factor when WriteBooster is disabled, supporting better efficiency and endurance.

The QLC UFS 4.1 devices are designed for read-intensive workloads. Smartphones and tablets remain the primary targets, as these devices require more storage for AI features, high-resolution media, and complex applications. Kioxia also sees opportunities beyond mobile. Potential applications include PCs, networking systems, AR and VR devices, IoT platforms, and AI-enabled products that need high capacity in compact designs.

The devices are available in 512GB and 1TB capacities. Each product integrates BiCS FLASH 3D memory and a controller in a JEDEC-standard package. The eighth-generation BiCS FLASH introduces CMOS directly Bonded to Array (CBA) technology. This architecture separates the memory cell array and peripheral circuits, enabling gains in performance and power efficiency.

The new memory complies with the UFS 4.1 specification and remains backward-compatible with UFS 4.0 and UFS 3.1. It supports WriteBooster for faster write operations. Kioxia has also reduced the package size to 9 × 13 mm, down from 11 × 13 mm in the previous QLC UFS generation.

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