Point2 Technology has announced an extension of its Series B funding round, raising total capital to $76 million. The round was led by Maverick Silicon, with participation from NVentures and UMC Capital.
The company, which develops RF-based interconnect technologies for AI data center infrastructure, said the funding will support its transition from development to commercialization. Investments will be directed toward scaling its Active RF Cable (ARC) platform, alongside advancing near-package (NPE) and co-packaged e-Tube (CPE) solutions designed for next-generation rack-scale compute systems.
The funding comes at a time when interconnect performance is emerging as a critical constraint in AI infrastructure. As hyperscale operators deploy increasingly dense and tightly integrated XPU clusters, traditional interconnect technologies face growing limitations. Copper-based systems are approaching their physical limits at higher data rates, while optical alternatives introduce challenges related to power consumption, cost, and system complexity.
Point2’s approach leverages RF signaling over plastic waveguides through its proprietary e-Tube platform, offering an alternative designed to address these challenges. According to the company, the technology aims to deliver extended reach, improved bandwidth density, and reduced latency, while maintaining energy efficiency and cost competitiveness.
The company claims that its e-Tube platform can deliver up to ten times the reach of conventional copper solutions, while reducing weight and cable volume. It also targets lower power consumption and latency compared to optical interconnects, positioning it as a potential enabler for large-scale AI compute environments.
Industry interest in alternative interconnect technologies has been growing as data center architectures evolve to support AI workloads. Point2’s inclusion among winners of the BloombergNEF Pioneers program for sustainable and scalable data center infrastructure reflects increasing attention toward solutions addressing efficiency and scalability challenges.
Company executives noted that the funding will also support expansion of engineering and systems teams, as well as ongoing product development efforts. The focus remains on accelerating deployment timelines and strengthening partnerships across the data center ecosystem.
Investors highlighted the potential of RF-based interconnect solutions to address bottlenecks in next-generation computing systems. The collaboration is expected to support broader adoption of emerging interconnect architectures as AI infrastructure continues to scale.
