Credo Technology Group Holding Ltd (NASDAQ: CRDO) has completed its acquisition of DustPhotonics, expanding its optical connectivity portfolio for next-generation AI infrastructure deployments.
The acquisition strengthens Credo’s capabilities in silicon photonics and optical interconnect technologies used in hyperscale AI networks and high-performance data center environments.
According to the company, DustPhotonics brings advanced silicon photonics photonic integrated circuit (SiPho PIC) technology that will support Credo’s portfolio across 800G, 1.6T, and 3.2T near-packaged optics (NPO) and co-packaged optics (CPO).
With the addition of DustPhotonics, Credo said it now offers a vertically integrated connectivity stack spanning serializer/deserializer (SerDes) technologies, digital signal processors (DSPs), silicon photonics, and system-level integration.
The company said the combined platform is designed to support both electrical and optical interconnect requirements for scale-out and scale-up AI infrastructure networks.
Industry demand for optical connectivity technologies has increased sharply as hyperscale AI deployments require higher bandwidth, lower latency, and improved power efficiency across large-scale computing clusters.
Credo stated that its combined portfolio of ZeroFlap optical transceivers, optical DSPs, and silicon photonics products is expected to become a major growth driver during fiscal 2027 as adoption of AI infrastructure expands globally.
Bill Brennan said the acquisition combines two technology-focused organizations with shared expertise in innovation, optical connectivity, and energy-efficient infrastructure solutions.
He added that the integration would help advance Credo’s end-to-end optical connectivity platform for customers scaling AI infrastructure deployments.
Ronnen Lovinger said silicon photonics is expected to become an increasingly important technology for AI-driven optical connectivity as demand for bandwidth and infrastructure scale continues to rise.
