Amkor Technology (Nasdaq: AMKR) has entered a multi-year strategic partnership with NVIDIA to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms, as demand for AI infrastructure continues to reshape the semiconductor industry.
Under the agreement, NVIDIA will provide a prepayment to support the expansion of Amkor’s advanced packaging capacity in the United States. Financial terms of the prepayment were not disclosed.
The collaboration will focus on advancing packaging technologies that improve chip performance, power efficiency and system-level integration—capabilities that have become increasingly important as AI processors grow larger and more complex.
The companies said they will align their long-term technology roadmaps to develop high-density interconnects and next-generation heterogeneous integration technologies for future AI platforms.
Advanced packaging has become a critical part of semiconductor manufacturing, enabling multiple chiplets and memory components to be integrated into a single package. The technology plays a central role in improving computing performance while reducing power consumption, making it essential for AI servers and high-performance computing systems.
Amkor has been a packaging and testing partner for NVIDIA across several products, including data centre processors, networking chipsets and accelerated computing platforms. The expanded partnership aims to accelerate the commercial deployment of new packaging technologies as AI infrastructure investments continue to rise.
The agreement also supports efforts to strengthen semiconductor manufacturing and supply-chain resilience in the United States. Amkor said the partnership will expand its advanced packaging and test capabilities in Arizona, complementing its manufacturing operations across Asia and creating a more geographically diversified supply chain.
Debora Shoquist, Executive Vice President of Operations at NVIDIA, said AI is creating a generational shift in computing and increasing the need for resilient manufacturing and supply chains.
She said Amkor’s global manufacturing capabilities and investments in U.S. operations would support the development of next-generation AI infrastructure.
Amkor Chief Executive Officer Kevin Engel said the partnership reinforces the growing importance of advanced packaging in enabling AI technologies.
He said the agreement accelerates the company’s long-term technology roadmap while strengthening its ability to deliver end-to-end advanced packaging and test services through a combination of its global manufacturing footprint and expanding U.S. operations.
