KAGA FEI Co., Ltd. has expanded its Bluetooth Low Energy module portfolio with two new software-embedded modules aimed at helping device manufacturers reduce wireless development time and costs as connectivity demand grows across industrial, residential and healthcare applications.
The company announced the development of the ES4L15MA1 and EC4L15MA1, which are based on Nordic Semiconductor’s nRF54L15 platform. The modules integrate functions required for Bluetooth Low Energy communication, allowing manufacturers to add wireless connectivity without developing the underlying communication software from scratch.
KAGA FEI said the approach is intended to address a growing shortage of Bluetooth software engineering expertise and increasingly long development cycles. The modules can be controlled through serial commands, allowing developers to configure connections and manage Bluetooth functions through an external device.
The modules are designed to support simultaneous connections with up to eight Bluetooth Low Energy devices. This capability is aimed at applications such as sensor networks and equipment monitoring, where multiple devices need to communicate with a central system.
The company’s proprietary software uses command-based control for connection management and communication. The modules can also transmit and receive user-defined text data, enabling two-way communication between connected devices. KAGA FEI said this makes the products suitable for applications seeking to replace conventional wired serial connections with wireless links.
Both modules include a built-in antenna, removing the need for manufacturers to undertake separate antenna design. They have also received Bluetooth SIG qualification and certifications under Japan’s Radio Law MIC, the U.S. Federal Communications Commission (FCC) and Canada’s Innovation, Science and Economic Development (ISED) framework.
Pre-certification could help manufacturers reduce the time and cost associated with regulatory testing when developing connected products, particularly for companies with limited in-house wireless engineering resources.
The products are aimed at a broad range of Internet of Things applications, including industrial equipment, housing equipment and healthcare devices. The integration of hardware and software functions is intended to simplify the process of adding Bluetooth connectivity to such products.
The EC4L15MA1 is already in mass production, while KAGA FEI plans to begin sampling the ES4L15MA1 in January 2027, followed by mass production in February 2027.
The expansion comes as manufacturers increasingly look for pre-integrated wireless modules that can shorten development cycles while supporting multi-device connectivity.
