Valens Semiconductor (NYSE: VLN) is collaborating with onsemi on a cost-optimized integrated sensor solution designed for high-volume 3-megapixel automotive camera applications, as automakers adopt higher-speed connectivity standards for vehicle imaging systems.
Under the collaboration agreement, Valens will work with onsemi to develop an A-PHY solution that can be integrated into onsemi’s image sensors. The companies said the effort is intended to provide automakers and Tier 1 suppliers with a more direct path to deploying MIPI A-PHY in mainstream automotive camera applications.
The collaboration combines Valens’ expertise in high-speed automotive connectivity with onsemi’s image-sensing technology. The companies said the integrated approach could simplify camera architectures and reduce component requirements while maintaining compatibility with the MIPI A-PHY standard.
Targeting 3MP Automotive Cameras
The companies are targeting the 3MP segment, which Valens said represents a significant portion of the automotive image-sensor market. Many automotive camera systems currently use sensors in the 1MP to 3MP range, while newer vehicle architectures are moving toward higher-resolution imaging.
A cost-optimized 3MP solution could therefore provide an entry point for applying A-PHY connectivity across higher-volume vehicle programs, according to the companies.
Yoram Salinger, CEO of Valens Semiconductor, said the collaboration would expand the range of applications for A-PHY while adding another supplier option to the ecosystem.
Ahmed Salem, Vice President and General Manager of the Intelligent Sensing Group at onsemi, said automotive customers are seeking camera solutions that can simplify system design as imaging requirements become more complex.
The companies did not disclose pricing, sampling schedules or production timelines for the integrated solution.
MIPI A-PHY Targets Automotive Connectivity
MIPI A-PHY is an automotive connectivity standard developed for high-speed links between image sensors and processing systems. It is designed to address connectivity requirements in vehicles where cameras and other sensors increasingly feed centralized or distributed computing architectures.
Valens has developed A-PHY-compliant chipsets, including its VA7000 family, and has previously reported design wins with multiple European automakers. The company said its existing A-PHY portfolio will be complemented by the integrated 3MP offering being developed with onsemi.
For automakers and Tier 1 suppliers, integrating connectivity functionality with an image sensor can potentially reduce the number of discrete components required in a camera system. It may also simplify implementation of a standardized connectivity architecture across different vehicle platforms.
The collaboration comes as automotive electronics architectures increasingly centralize computing and expand the number and resolution of cameras used for driver assistance, automated driving and other vehicle functions.
Valens and onsemi said the new offering is intended to support high-volume applications while strengthening the broader A-PHY ecosystem. Further technical details and commercial availability are expected as development progresses.
