OMNIVISION has launched the OG12S10, a 12-megapixel backside-illuminated global shutter CMOS image sensor designed for factory automation and intelligent transportation systems, targeting applications that require accurate image capture during high-speed motion.
The new sensor combines a 3.45-micron pixel with OMNIVISION’s PureCel®Plus-S pixel architecture and Nyxel® near-infrared technology. The company said the design is intended to improve sensitivity and image quality in demanding industrial and transportation environments.
Designed for High-Speed Imaging
The OG12S10 offers a 4096 x 3072 resolution and can capture images at up to 75 frames per second. Its global shutter architecture synchronises exposure across each frame, helping reduce motion distortion when objects or cameras are moving rapidly.
The sensor supports exposure times as short as 1 microsecond, a feature aimed at applications requiring precise control of fast-moving equipment.
OMNIVISION said the sensor achieves a 74dB dynamic range using its dual conversion gain HDR technology. It has a full-well capacity of 20,000 electrons and read noise of 2.8 electrons in DCG mode.
The device also incorporates a 12-bit analog-to-digital converter to support image processing and capture across a wider range of lighting conditions.
Higher NIR Sensitivity
The OG12S10 uses OMNIVISION’s Nyxel technology to improve near-infrared imaging performance. The sensor delivers quantum efficiency of 60% at 850nm and 40% at 940nm, according to the company.
OMNIVISION said the performance represents a fivefold increase in quantum efficiency compared with its existing 3.45-micron product.
Near-infrared sensitivity can be important for industrial vision and intelligent transportation applications that use infrared illumination or need consistent imaging in challenging lighting conditions.
Kelly Yan, staff marketing manager at OMNIVISION, said global shutter technology helps maintain image clarity in environments where speed, vibration and motion are constant by capturing each frame with synchronised exposure.
The OG12S10 also uses PureCel®Plus-S die-stacking technology. Its interfaces include a 16-lane sub-LVDS connection supporting up to 1.1Gbps and a four-lane MIPI interface.
The sensor will be offered in a ceramic land grid array package. OMNIVISION plans to begin sampling the OG12S10 in November 2026, with mass production scheduled for the fourth quarter of 2026.
