SK Hynix has dismissed reports that it is considering acquiring Intel’s semiconductor campus in Ohio, saying it has neither pursued nor decided on such a transaction. Intel also reaffirmed its commitment to completing the project, seeking to quell speculation over the future of one of the largest semiconductor investments in the United States.
The clarification follows a report by Korea JoongAng Daily, which said SK Hynix was considering acquiring Intel’s under-construction Ohio fabrication campus to establish memory chip production in the US within the next five years. The report attracted industry attention because such a deal would have represented a significant shift in both companies’ manufacturing strategies and the broader US semiconductor landscape.
In a regulatory disclosure, SK Hynix said it continues to review investment and acquisition opportunities as part of its business strategy. However, it added that it had neither pursued nor decided to acquire Intel’s Ohio site or fabrication facilities. A company spokesperson also told local media that the company had “no plans for an acquisition.”
Intel issued a separate statement reaffirming its commitment to the Ohio project. The company said construction and site readiness activities would continue, adding that the campus remains a key pillar of its long-term US manufacturing strategy. Intel did not confirm any discussions related to a potential sale.
The swift response from both companies effectively put to rest speculation over a transaction that could have significantly expanded SK Hynix’s manufacturing footprint in the United States.
While SK Hynix continues to increase its US presence, its investments have focused on advanced semiconductor packaging and research rather than front-end wafer fabrication. The company is building an advanced packaging facility and AI memory research centre in Indiana to support growing demand for high-bandwidth memory (HBM) used in artificial intelligence applications.
The speculation nevertheless underscored the strategic value of Intel’s Ohio campus. Announced as the centrepiece of Intel’s US manufacturing expansion, the project has experienced delays amid softer semiconductor demand and changing capital expenditure plans. Public reports indicate the first fabrication plant is now expected to begin operations around 2030, later than originally planned.
Despite the revised timeline, Intel has repeatedly described the Ohio campus as a cornerstone of its foundry strategy and broader efforts to expand domestic semiconductor manufacturing. By publicly reiterating its commitment, the company also sought to dispel speculation that it could be reconsidering its long-term investment plans.
Industry observers said the episode highlights the growing strategic importance of semiconductor manufacturing assets in the United States as governments and chipmakers seek to strengthen supply chains amid rising AI demand and geopolitical uncertainty.
Although SK Hynix ruled out pursuing Intel’s Ohio facility, analysts noted that the company remains committed to expanding its US operations through investments in advanced packaging and R&D. For Intel, the incident reinforces continued market interest in the Ohio campus, even as the company pushes ahead with a longer-than-expected construction timeline.
