Synopsys, Inc. (NASDAQ: SNPS) has announced the availability of the first wave of its Multiphysics Fusion solutions, expanding its electronic design automation (EDA) portfolio to address growing engineering challenges in advanced semiconductor design.
The launch combines Synopsys’ AI-powered EDA tools with Ansys signoff analysis technologies. The company said the integrated approach is designed to help chipmakers address issues related to signal integrity, power integrity, thermal effects, electromagnetics, and multi-die architectures.
As semiconductor designs become more complex, particularly for artificial intelligence (AI) and high-performance computing (HPC) applications, engineers increasingly need to account for interactions between multiple physical domains during the design process. Synopsys said traditional workflows often require separate tools and multiple design iterations, which can increase development time and costs.
The Multiphysics Fusion portfolio is intended to bring these analyses together within a unified workflow. According to the company, the solutions support timing signoff, design closure, multi-die development, and analog and photonic design.
“Multiphysics is fundamentally reshaping how advanced semiconductor designs are engineered,” said Sanjay Bali, Senior Vice President of EDA Product Management and Strategy at Synopsys.
The first set of offerings includes four targeted solutions.
The Multiphysics Fusion solution for timing signoff integrates Synopsys PrimeTime with RedHawk-SC and RedHawk-SC Electrothermal technologies. Synopsys said the platform delivers up to three times faster runtimes while incorporating power, thermal, and stress effects into timing analysis.
The design closure solution combines PrimeClosure with RedHawk-SC to embed power integrity directly into optimization workflows. The company said this can deliver up to ten times faster design closure while improving power, performance, and area metrics.
For multi-die architectures, Synopsys has integrated its 3DIC Compiler platform with RedHawk-SC, RedHawk-SC Electrothermal, and HFSS-IC technologies. The solution enables concurrent analysis of power integrity, thermal behavior, and electromagnetic effects throughout the design process.
The company also introduced a Multiphysics Fusion workflow for analog and photonic designs. The platform combines Custom Compiler with HFSS-IC for electromagnetic analysis and integrates OptoCompiler with Lumerical software to support photonic integrated circuits and co-packaged optics development.
Synopsys said the solutions use GPU acceleration powered by NVIDIA technologies, including CUDA-X libraries and cuDSS. According to the company, this enables faster simulation of SPICE, electromagnetic, and power integrity workloads.
Several industry companies have already evaluated the technology.
Taiwan-based semiconductor company MediaTek said the platform provides earlier visibility into interactions across silicon, packaging, and optical domains while reducing development cycles.
U.S.-based AI computing company NVIDIA said Synopsys is leveraging its accelerated computing technologies to scale increasingly complex engineering workloads. NVIDIA added that pilot projects using Multiphysics Fusion achieved faster design closure and higher rates of power integrity issue resolution.
South Korea’s Samsung Electronics said the technology enables more accurate timing signoff by incorporating power, thermal, and stress effects directly into the analysis process.
The Cisco Silicon One group is also using the platform to integrate power integrity analysis into design closure workflows. According to Synopsys, the approach helps engineers identify issues earlier and improve overall chip optimization.
