Wolfspeed is expanding its silicon carbide power portfolio with two new 3.3 kV SiC power module families aimed at addressing rising energy demands linked to AI data centers, renewable energy infrastructure, and grid modernization.
Wolfspeed (NYSE: WOLF) introduced the new modules in two industry-standard footprints, targeting applications that require higher efficiency, improved power density, and continuous high-voltage operation. The launch comes as utilities, data center operators, and industrial infrastructure providers face increasing pressure to scale power generation and distribution systems for AI-driven workloads and electrification trends.
The new product lineup includes a high-power half-bridge baseplate SiC power module designed for applications exceeding 800 amps, and a scalable full-bridge baseplate-less module under the company’s WolfPACK® family.
According to Wolfspeed, both module families are designed to support 2 kV and higher DC-link architectures while enabling engineers to reduce power stages and move toward simplified two-level topologies.
“The release of this 3.3 kV MOSFET voltage node in two complementary footprints was a strategic decision,” said Guy Moxey, vice president of Wolfspeed’s Industrial & Energy business.
He said the company is responding to growing demand from customers building next-generation power infrastructure for AI data centers, renewable energy systems, and industrial electrification.
The high-power baseplate module is optimized for converter topologies used in solar installations, grid-scale battery energy storage systems, and wind-power infrastructure. The scalable WolfPACK® module, meanwhile, is designed for modular architectures such as solid-state transformers and renewable energy systems requiring multi-level, series-stacked, or parallel converter configurations.
Wolfspeed said both module families are engineered for continuous 24/7 operation in high-voltage environments. The products incorporate Gen 4 SiC technology with improved resistance to cosmic ray susceptibility, alongside advanced packaging technologies intended to improve durability and thermal performance.
The WolfPACK modules use sintered die attach and epoxy encapsulant materials to improve power cycling performance compared to conventional silicon gel-based modules. The baseplate modules also integrate sintered die attach and a copper die-top system to enhance reliability in demanding operating conditions.
The launch reflects broader industry efforts to improve efficiency and reduce energy losses across increasingly power-intensive AI infrastructure. As hyperscale data centers expand globally, power conversion efficiency has become a critical factor in managing operational costs and supporting grid stability.
Amperesand CEO Brian Dow said advances in silicon carbide technology are helping enable more compact and efficient power delivery systems for AI-related infrastructure.
“Critical power delivery from medium voltage to AI rack requires best-in-class reliability, power density, efficiency, and cost effectiveness,” Dow said.
According to Wolfspeed, the WolfPACK module can help reduce the footprint of solid-state transformer systems by more than 50% compared to conventional equipment through improved switching performance and optimized system architecture.
The company also stated that its new high-power baseplate module delivers up to 42% lower switching losses than comparable SiC products currently available in the market, and more than 90% lower switching losses compared to IGBT-based solutions under similar operating conditions.
Both module families are intended to reduce the size of magnetics and EMI filters, contributing to lower overall system costs and higher power density for industrial and energy infrastructure applications.
