As semiconductor manufacturers push toward larger, denser, and more complex chip architectures for AI and high-performance computing, packaging materials are emerging as a critical area of innovation.
Asahi Kasei has developed a new photosensitive polyimide (PSPI) film aimed at advanced panel-level semiconductor packaging, a segment gaining momentum as the industry looks for higher manufacturing efficiency and improved production yield.
The new material combines the characteristics of the company’s PIMEL™ liquid PSPI technology and SUNFORT™ dry film photoresist platform. According to Asahi Kasei, the film is currently undergoing customer evaluations, with commercial rollout expected in the near future.
The development comes as semiconductor packaging shifts from conventional wafer-level processes toward larger panel-level manufacturing. The transition is being driven by increasing demand for AI accelerators, data center processors, and high-density semiconductor packages that require finer wiring patterns and additional insulating layers.
Industry analysts view advanced packaging as one of the key enablers for next-generation AI chips, particularly as traditional transistor scaling becomes more challenging and manufacturers increasingly rely on chiplet architectures and 3D integration technologies.
Asahi Kasei said the newly developed PSPI film is designed to support easier and more uniform lamination across large square panels while improving productivity during semiconductor package manufacturing.
The company expects the material to be used in redistribution layers and insulating layers for advanced package substrates.
The PSPI film can also be paired with the company’s SUNFORT™ TA series, which supports formation of ultra-fine 1.0-micron circuit patterns. This combination allows both insulating resin layers and fine circuit structures to be formed through film lamination processes.
In parallel, Asahi Kasei is developing solutions that integrate the PSPI film with its SUNFORT™ CX series to support high-aspect-ratio copper pillar formation required for three-dimensional semiconductor packaging.
“As the performance of AI semiconductors improves, advanced semiconductor packaging requires mounting technologies that cover larger areas and offer higher precision,” said Nobuko Uetake, Senior Executive Officer responsible for the company’s Electronic Materials business.
She added that the new material is intended to help customers improve manufacturing yield and productivity while supporting further advances in semiconductor packaging technologies.
Demand for advanced packaging materials continues to rise as chipmakers increase packaging density and expand interposer sizes to meet the processing requirements of AI data centers and high-performance computing systems.
The company said packaging structures are becoming increasingly multi-layered and three-dimensional, raising performance requirements for materials used in semiconductor assembly processes.
Electronics remains one of Asahi Kasei’s strategic growth areas under its medium-term business plan, with semiconductor packaging materials expected to play a larger role as global AI infrastructure investments continue to accelerate.
