3D Glass Solutions Inc. (3DGS), a leading innovator of glass-based three-dimensional integrated passive solutions for radio frequency (RF), photonic and datacenters today…
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AnalogNewsProduct LaunchSemiconductorsTechnology
Cadence Unleashes the Future of Analog, Custom and RFIC Design with Pioneering AI-Powered Virtuoso Studio
by EC Editorby EC EditorCadence Design Systems, Inc. (Nasdaq: CDNS) today announced the new Cadence Virtuoso Studio, a next-generation custom design platform that delivers an optimal…
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NewsProduct LaunchSemiconductorsTechnology
Rambus Accelerates AI Performance with Industry-Leading 24 Gb/s GDDR6 PHY
by EC Editorby EC EditorRambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced a new product milestone for GDDR6 memory interface…
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BusinessNewsSemiconductorsTechnology
Vedanta Expects to Start Building Semiconductor Plant by October-December Quarter
by EC Editorby EC EditorVedanta group is expecting to start building its Rs 1.5 lakh crore semiconductor plant in October-December this year and producing electronic chips…
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BusinessNews
Mixel MIPI C-PHY/D-PHY Combo IP Integrated into Hercules Microelectronics HME-H3 FPGA
by EC Editorby EC EditorMixel, Inc. (Mixel), a leading provider of mixed-signal intellectual property (IP), and Hercules Microelectronics (HME), a China-based developer of programmable FPGA cores,…