Rambus Inc. (NASDAQ: RMBS) has introduced its PCIe 7.0 Switch IP with Time Division Multiplexing (TDM), expanding its interconnect portfolio to address…
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High-Performance Computing
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AI / AR / VRBusinessData CenterNewsProduct LaunchSemiconductorsTechnology
GUC, Ayar Labs Team Up to Advance Co-Packaged Optics for AI
by EC Editorby EC EditorGlobal Unichip Corp. (GUC) and Ayar Labs have entered into a strategic partnership aimed at accelerating the integration of co-packaged optics (CPO)…
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BusinessNewsSemiconductorsTechnology
Baya Systems Opens U.K. Office to Expand AI and Chiplet Operations in Europe
by EC Editorby EC EditorBaya Systems, a developer of software-driven, chiplet-ready semiconductor fabric IP for scalable AI and high-performance computing, has opened its first European office…
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AI / AR / VRNewsTechnology
New AI Supercomputers at Argonne to Accelerate U.S. Scientific Innovation
by EC Editorby EC EditorThe U.S. Department of Energy (DOE) and Argonne National Laboratory have announced a major public-private initiative with NVIDIA and Oracle to build…
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BusinessNewsSemiconductorsTechnology
Tachyum Opens Taiwan Offices Ahead of Prodigy Universal Processor Launch
by EC Editorby EC EditorTachyum has opened new offices in Taiwan as it prepares for the production of its Prodigy® Universal Processor, marking a strategic expansion…