L&T Semiconductor Technologies Ltd (LTSCT), a wholly owned subsidiary of Larsen & Toubro, has joined the imec-led Automotive Chiplet Program (ACP), marking a strategic step into global efforts to define next-generation semiconductor architectures for the automotive sector.
The ACP is a pre-competitive research initiative that brings together industry stakeholders to evaluate chiplet-based designs and advanced packaging technologies. The program focuses on addressing growing demands for performance, safety, reliability, and lifecycle efficiency in automotive electronics, while enabling flexibility and scalability through modular chiplet architectures.
The development reflects a broader shift in the industry as conventional monolithic system-on-chip (SoC) designs face increasing limitations. The rapid evolution of advanced driver-assistance systems (ADAS), software-defined vehicles (SDVs), and in-vehicle infotainment (IVI) systems is driving the need for higher compute density and bandwidth. Chiplets—modular silicon components interconnected through 2.5D and 3D packaging—are emerging as a viable alternative, offering improved performance per watt, faster development cycles, and enhanced supply chain resilience.
Sandeep Kumar, Chief Executive of LTSCT, said the transition toward software-defined vehicle architectures is accelerating the need for modular and scalable hardware platforms. He noted that chiplets represent a structural shift in how integration and performance are achieved in automotive systems.
As part of the program, LTSCT will contribute to defining standards and reference designs for chiplet-based automotive platforms. The company’s areas of focus include safety-critical compute partitioning, high-bandwidth die-to-die interconnects, and end-to-end validation frameworks covering manufacturing through field deployment. It also intends to provide practical input on product qualification, diagnostics, and lifecycle management under real-world automotive conditions.
Bart Placklé, Vice President of Automotive Technologies at imec, said collaboration across the ecosystem is essential to make chiplet architectures commercially viable. He noted that aligning on interoperable standards would allow automakers to integrate both proprietary and off-the-shelf chiplets into customized systems, while reducing vendor lock-in and improving efficiency.
The Automotive Chiplet Program builds on imec’s established expertise in advanced semiconductor packaging and its global network of partners across the semiconductor and automotive industries. The initiative aims to accelerate the transition to chiplet-based designs as vehicles become increasingly software-driven and compute-intensive.
