Allegro DVT has contributed semiconductor video processing technology to a European research project developing a standardized chiplet platform for software-defined vehicles, as the automotive industry looks to adopt more modular semiconductor architectures.
The company said its video encoding and decoding intellectual property (IP) has been integrated into the Automotive Base Die, a 5-nanometer chiplet being developed under the CHASSIS programme, a European initiative aimed at establishing an open chiplet ecosystem for future automotive systems.
The Automotive Base Die is designed to serve as a common integration layer for automotive system-on-chip (SoC) platforms, allowing chiplets from multiple vendors to communicate through the Universal Chiplet Interconnect Express (UCIe) standard.
The project is funded under the European Chips Joint Undertaking (Chips JU) programme and brings together companies and research organisations including BMW, Bosch and imec. Bosch is coordinating the three-year initiative.
Chiplet technology is attracting growing interest across the semiconductor industry as manufacturers seek alternatives to increasingly complex monolithic chip designs. By dividing functions across smaller interconnected chips, developers aim to improve scalability, shorten development cycles and reduce design costs.
Allegro DVT said its technology will support video processing for applications including advanced driver assistance systems (ADAS), surround-view cameras and in-vehicle infotainment, where multiple high-resolution video streams must be processed with low latency and reduced power consumption.
The company said the video IP is designed to optimise memory bandwidth and enable real-time processing while supporting integration across heterogeneous chiplets.
The Automotive Base Die is intended to allow early interoperability testing between chiplets from different suppliers, a step that could simplify the development of software-defined vehicle platforms and encourage wider adoption of open semiconductor standards.
The CHASSIS programme forms part of Europe’s broader strategy to strengthen domestic semiconductor capabilities. The European Union has increased investment in chip research and manufacturing following supply chain disruptions during the COVID-19 pandemic and growing competition from the United States and Asia.
Under the Chips JU framework, projects are focused on developing strategic semiconductor technologies while expanding Europe’s design and manufacturing ecosystem.
The Automotive Base Die is expected to provide a common hardware foundation for integrating compute, connectivity and application-specific chiplets into future vehicle platforms. Supporters of the initiative say standardisation could increase flexibility for automakers and suppliers while accelerating the deployment of software-defined vehicle technologies.
Funding for the CHASSIS programme is provided through the Chips Joint Undertaking and participating national authorities under grant agreement 101252788.
