Samsung Electronics Co. Ltd has announced the commencement of mass production for its automotive Universal Flash Storage (UFS) 3.1 memory solution, designed…
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Technology
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NewsProduct LaunchSemiconductorsTechnology
Toshiba Unveils Third-Generation SiC Schottky Barrier Diodes for Enhanced Industrial Efficiency
by EC Editorby EC EditorIn a move that promises to revolutionize the industrial equipment sector, Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has officially launched its…
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NewsTechnologyWireless & Networking
Juniper Networks Elevates Digital Experience at University of Oxford with AI-Driven Wireless Solution
by EC Editorby EC EditorIn a significant development, Juniper Networks, a leading provider of secure, AI-driven networks, has announced the successful deployment of its cloud-delivered wireless…
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BusinessNewsSemiconductorsTechnology
Cycuity Receives ISO/SAE 21434 Certification, Strengthening Automotive Cybersecurity Compliance
by EC Editorby EC EditorCycuity, Inc., a provider of semiconductor security solutions, announces the attainment of ISO/SAE 21434 certification for its Radix security product and engineering…
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BusinessNewsSemiconductorsTechnology
Foxconn Withdraws from JV for Chip Manufacture, Vedanta to Go Ahead
by EC Editorby EC EditorIn a major setback to Prime Minister Narendra Modi’s plans of making India a chip-manufacturing hub, Taiwanese chip-making giant Foxconn on Monday…