Micron Technology introduces compact 9×13 mm UFS 4.0 mobile solution, featuring breakthrough firmware, 232-layer 3D NAND, and up to 1TB capacity. …
Category:
Semiconductors
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BusinessNewsProduct LaunchSemiconductorsTechnology
Kappa Optronics Chooses THine for Safer Driving Tech
by EC Editorby EC EditorIn a strategic collaboration, Kappa Optronics integrates THine Solutions’ V-by-One HS Chipset to enhance digital mirror solutions for improved automotive safety. …
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NewsProduct LaunchSemiconductorsTechnology
Mitsubishi Electric’s 6.5W RF MOSFET Boosts Radio Performance
by EC Editorby EC EditorMitsubishi Electric Corporation (TOKYO: 6503) introduces a groundbreaking development in radio-frequency (RF) technology with the release of its RD06LUS2, a 6.5W silicon…
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AI / AR / VRNewsProduct LaunchSemiconductorsTechnology
Intel Debuts AI-Era Systems Foundry, Unveils Robust Process Roadmap
by EC Editorby EC EditorIntel Corporation (INTC) makes a significant stride into the future with the inauguration of Intel Foundry, an eco-conscious systems foundry tailored for…
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NewsProduct LaunchSemiconductorsTechnology
Toshiba Unveils DTMOSVI(HSD) Power MOSFETs for Enhanced Efficiency
by EC Editorby EC EditorToshiba Electronic Devices & Storage Corporation has introduced the latest additions to its DTMOSVI series – the DTMOSVI(HSD) power MOSFETs. Specifically designed…